LCP High Speed ​​RF PCB Circuit Board

Make board parameters:

Layers: 4L

Plate: LCP material

Plate thickness: 0.40 plus\/- 0.05mm

Finished copper thickness: 35\/18\/18\/35 um

Surface treatment: immersion silver (Ag: 0.20- 0.30um)

Solder mask color: black

Finished product size: 171595mm

Stacking structure: (see the figure below for details)

L1 copper thickness 18um electroplating to 35um

Medium thickness: 100um

L2 copper thickness 18um

Medium thickness: 25um

Medium thickness: 75um

Medium thickness: 25um

L3 copper thickness 18um

Medium thickness: 100um

L4 copper thickness 18um electroplating to 35um

LCP material is a commonly used material for high-speed RF PCB circuit boards. It is the abbreviation of LIQUID CRYSTAL POLYMER and is a special polymer material.

LCP materials have the following characteristics:

1. LCP material has the characteristics of abnormally regular fibrous structure and self-reinforcement;

2. LCP material has excellent flame retardancy, good radiation resistance and good weather resistance;

3. LCP products will not be corroded in an environment with a concentration of 50 percent alkali or a concentration of 90 percent acid, and has strong corrosion resistance. After contacting some industrial solvents, it will not be dissolved;

4. For LCP materials, the intermittent use temperature can reach about 316 degrees Celsius; the continuous use temperature range is 200-300 degrees Celsius. In this temperature range, its electrical properties will not be affected in any way, and its electrical insulation performance is excellent.

LCP high-speed RF PCB circuit boards are now widely used in the 5G field