Aluminum substrate PCB is the most cost-effective type of metal-based PCB. Its heat dissipation performance is better than that of copper-based PCB boards and iron-based PCB boards that are both metal substrates, its product life can be extended. Aluminum-based PCB boards are widely used in the LED lighting equipment industry, In addition, it is also commonly used in a series of audio equipment such as audio amplifiers, power supply equipment such as switching regulators, and automotive equipment such as ignites.
Classified by surface treatment process, it is generally divided into tin-sprayed aluminum-based PCB board, anti-alumina-based PCB board, silver-plated aluminum-based PCB board and immersion gold aluminum-based PCB board.
Common thicknesses of aluminum-based PCBs are typically 0.8 mm, 1.0 mm, 1.2 mm, 1.5 mm, 2.0 mm, 2.5 mm, and 3.0 mm. Copper foil thicknesses are typically 18 um, 35 um, 70 um, 105 um and 140 um.
The thermal insulation layer is one of the most important core technologies of the aluminum substrate, and it is basically composed of a special polymer filled with a special porcelain.
The basic production process of aluminum-based PCB boards can be divided into the following points:
1. Board cutting: Cut the whole large-sized aluminum substrate raw material according to the required production size, and avoid scratching the plate during the cutting process.
2. Drilling: By means of mechanical drilling, positioning holes, test holes and parts holes are drilled on the aluminum substrate.
3. Circuit: According to the data requirements, make the required circuit on the board.
4. Lamination: This process is very important, if the operation is improper, it may lead to the phenomenon of short circuit and open circuit of the board, and there may be dissatisfaction with the filling of glue or bubbles. The single-face hole filling method can avoid the above situation as far as possible.
5. Etching: After the circuit is completed, etch off the excess part and keep the required part.
6. Solder mask and silkscreen: Complete the solder mask and silkscreen according to the data requirements; Solder mask is to protect the circuit and prevent oxidation, silkscreen is convenient for follow-up electronic components plug-ins and maintenance.
7. Surface treatment: Copper in the exposed environment is very easy to oxidize, may lead to poor solderability, and the surface treatment is to protect the copper surface.
8. Final Shaping: Make the shape according to the data requirements.
9. Electrical performance test: Test whether the circuit is open and short circuit phenomenon, whether it can work normally.
10. Final inspection: Detection of shape, hole copper, solder mask, silkscreen items etc. It can be packed and shipped after passing the final inspection.