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8-layer soft-hard combination circuit board (through-hole board)

8-layer soft-hard combination circuit board (through-hole board)

The soft-hard circuit board is made of soft board material polyimide (PI) and hard board material FR4 pressed together. It is a special PCB circuit board that integrates soft board and hard board. It is very flexible. Design the part that needs to be bent into a soft board,
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Product description

The soft-hard circuit board is made of soft board material polyimide (PI) and hard board materialsFR4Made by pressing together, it is a special combination of soft board and hard board.PCBCircuit boards are very flexible. The parts that need to be bent are designed as soft boards, and the parts that do not need to be bent are designed as hard boards, which can be flexibly adapted to the structural design of the product. Soft-hard circuit boards are widely used in automobiles, medical, Home appliances and other fields.

The product in the picture is an 8-layer soft-hard board (through-hole board)

Finished board size: 65.20156mm

Board structure: L1-L3 (hard board PCB) plus L4-L5 (soft board) plus L6-L8 (hard board PCB)

Completed copper thickness: soft board part: 18um, hard board part: outer layer: 35um, inner layer: 18um

Completed board thickness: hard board part: 1.20mm plus\/-0.12mm, soft board part: 0.10mm plus\/-0.03mm

Hole size: Through hole diameter 0.20mm

Surface treatment: immersed gold 2u

Solder mask color: green

Character color: white

Application areas: medical equipment

The stackup is as follows:

Pressure indication 8-layer soft-hard combination circuit board thickness (mm)

L1: HOZ plating to 38um 0.038

FR4 PP: 0.150

L2: Hard plate copper foil 0.018

PP glue 0.080

L3 hard plate copper foil 0.018

FR4 0.15

PP glue 0.080

Covering film PI 0.015

Cover film AD 0.0125

L4 soft board copper foil 0.018

Soft board PI 0.050

L5 soft board copper foil 0.018

Cover film AD 0.0125

Covering film PI 0.015

PP glue 0.080

FR4 0.15

L6 hard plate copper foil 0.018

PP glue 0.080

L7 hard plate copper foil 0.018

FR4 PP: 0.150

L8 HOZ electroplated to 38um 0.035


Theoretical thickness of hard plate lamination: 1.16mm plus\/-0.08mm

Finished hard board thickness: 1.20mm plus\/-0.20mm

Theoretical thickness of soft board lamination: 0.10mm plus\/-0.03mm

Finished soft board thickness: 0.10mm plus\/-0.03mm


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