The design of ordinary PCB is related to the production efficiency of the PCB, and has a great relationship with the cost. In order to improve the production efficiency of PCB circuit boards, reduce the scrap rate and save costs, the following matters should be paid attention to when designing:
1. Drilling Design. The minimum drilling hole diameter (via hole) of ordinary PCB circuit boards should be more than 0.30mm in diameter when space allows. The size of the minimum hole diameter directly affects the number of stacked plates during drilling and affects the efficiency of the drilling process. The spacing between different network holes needs to be designed to be more than 0.35mm to prevent the wick effect, which will cause short circuit and scrap.
2. Circuit design. The circuit width and spacing need to be designed according to the completed copper thickness. In the case of wiring space permitting, when the copper thickness is 1OZ, the circuit width/spacing should be designed to be more than 4/4 mil, the via hole solder ring is more than 4 mil, and the plug-in hole solder ring is more than 6 mil; when the copper thickness is 1.5OZ, the circuit width/spacing is designed to be more than 6/6 mil, the via hole solder ring is more than 5 mil, and the plug-in hole solder ring is more than 7 mil; when the copper thickness is 2OZ, the circuit width/spacing is designed to be more than 8/8 mil, the via hole welding ring is more than 8 mil, and the plug-in hole welding ring is more than 10 mil; When the copper thickness is 3OZ, the circuit width/spacing is designed to be more than 12/12 mil, the via hole welding ring is more than 10 mil, and the plug-in hole welding ring is more than 12 mil. If the circuit spacing is too small, it is easy to sandwich the film during electroplating, resulting in unclean etching and scrapping. In order to avoid damage to the circuit and exposed copper during molding, it is necessary to ensure that the copper foil and the line are more than 0.25mm away from the molding edge and 0.40mm away from the V-CUT edge.
3. Outline design. The width of the gong groove in the board is generally designed to be more than 1.60mm. If the gong groove is less than 1.60mm, the number of stacked plates in the gong plate needs to be reduced, which affects the efficiency of the gong plate process and increases the cost. When designing the panel, try to use the V-CUT panel as much as possible, which not only has high production efficiency, but also facilitates the panel division after the patch is completed.
The optimization of ordinary PCB design can not only improve production efficiency, improve quality, reduce scrap rate, but also save costs and improve the competitiveness of products in the market.